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Shandong Zhongshan Photoelectric Materials Co., Ltd

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Iinkcukacha zeNkampani

Shandong Zhongshan Photoelectric Materials Co., Ltd [Shandong,China] Uhlobo lo shishino:Manufacturer IMakethe: Africa , Americas Ngaphandle:21% - 30% ICredit:ISO9001, CCC Inkcazo:I-Semiconductor yokucoca iarhente,Iarhente yokucoca i-wafer,I-carbonyl fluoride semicondcuctor,Irhasi ekhethekileyo yekhemikhali,,

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I-Semiconductor / iarhente yokucoca i-wafer

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I-carbonyl fluoride cf2o yokuphucula iikhemikhali zekhemikhali

Ixabiso lento: USD 500 / Gram

Min.Order	Ixabiso lento
100 Gram	USD 500 / Gram

I-Carbonyl Fluoride CUS: 353-50 i-CF2O Hight Ukucoceka kwe-etha iarhente yekhemikhali Intshayelelo Intshayelelo Ubunzima be-molecular ye-carbonyl fluoride (cf 2 ) yi-66.01 kunye nendawo yayo yokunyibilika yi-76 ℃, indawo yokubila ngu -84 ℃....

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KwiChina I-Semiconductor / iarhente yokucoca i-wafer Abaxhasi

I-ZSEM ivelisa iintlobo ezahlukeneyo ze-fluorine-eneegesi ezinee-elektroniki ezineemitha ze-elektroniki kunye nezinyibilikisi ze-chip ze-chip zenza lula. Ngetekhnoloji yokutshintsha kwetekhnoloji kunye nokucocwa kwesixhobo sepropathi, iinkqubo zokucoca zenza nzima ixesha ngalinye. Uluhlu olukhuselekileyo luvela kumasuntswana kunye noluhlu lweedayamitha ze-0,1 ukuya kwi-20 microns, i-organic kunye nengcongconi, kunye nokungcola. Ukucoca i-wafer kufuneka kwenziwe ngaphandle kokwazisa nakwezinye izinto ezingcolileyo okanye ukungcola kumphezulu wokugqibela.

I-Semiconductor / iarhente yokucoca i-wafer
I-ZSEM ivelisa iintlobo ezahlukeneyo ze-fluorine-eneegesi ezinee-elektroniki ezineemitha ze-elektroniki kunye nezinyibilikisi ze-chip ze-chip zenza lula. Ngetekhnoloji yokutshintsha kwetekhnoloji kunye nokucocwa kwesixhobo sepropathi, iinkqubo zokucoca zenza nzima ixesha ngalinye. Uluhlu olukhuselekileyo luvela kumasuntswana kunye noluhlu lweedayamitha ze-0,1 ukuya kwi-20 microns, i-organic kunye nengcongconi, kunye nokungcola. Ukucoca i-wafer kufuneka kwenziwe ngaphandle kokwazisa nakwezinye izinto ezingcolileyo okanye ukungcola kumphezulu wokugqibela.

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